Optimization of copper(I) thiocyanate as hole transport material for solar cell by scaps-1D numerical analysis

In SSDSSC, various key parameters of CuSCN as HTM were explored using SCAPS-1D simulation software. A layer thickness of 3 µm with a moderate value of interface defect density was obtained yielding 2.56% of PCE in SSDSSC. TiO2 ETM and Ni back contact was found to be the best combination with CuSCN H...

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Main Authors: Arith, Faiz, Aliyaselvam, Omsri Vinasha, Mat junos, Siti Aisah, Izlan, Nurhazwani, Mohd Said, Muzalifah, Mustafa, Ahmad Nizamuddin
格式: Article
語言:English
出版: Przegląd Elektrotechniczny 2022
在線閱讀:http://eprints.utem.edu.my/id/eprint/26789/2/24.PDF
http://eprints.utem.edu.my/id/eprint/26789/
http://pe.org.pl/articles/2022/6/24.pdf
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