Modelling Of Wire Bonding Cu-Al Intermetallic Formation Growth Towards Interfacial Stress
Quality requirement in the semiconductor industry is getting more stringent due to the application of semiconductor components that are widely used in automotive. Furthermore different materials combination is being introduced to semiconductor packages to improve their package performance and reduce...
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| Format: | Thesis |
| Language: | English English |
| Published: |
UTeM
2017
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| Online Access: | http://eprints.utem.edu.my/id/eprint/23786/1/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress%20-%20Lee%20Cher%20Chia%20-%2024%20Pages.pdf http://eprints.utem.edu.my/id/eprint/23786/2/Modelling%20Of%20Wire%20Bonding%20Cu-Al%20Intermetallic%20Formation%20Growth%20Towards%20Interfacial%20Stress.pdf http://eprints.utem.edu.my/id/eprint/23786/ http://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=109161 |
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