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Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding

Low cost, high reliable and robust semiconductor packages are required in order for semiconductor manufacturer to stay competitive in the industry. This requires a stable manufacturing process that able to maintain high production yield, reduce customer reject and scrap cost. Currently, combination...

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Main Author: Tey, Sock Chien
Format: Thesis
Language:English
English
Published: 2016
Subjects:
T Technology (General)
TS Manufactures
Online Access:http://eprints.utem.edu.my/id/eprint/18372/1/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdf
http://eprints.utem.edu.my/id/eprint/18372/2/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdf
http://eprints.utem.edu.my/id/eprint/18372/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=100166
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spelling my.utem.eprints.183722021-10-08T07:59:00Z http://eprints.utem.edu.my/id/eprint/18372/ Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding Tey, Sock Chien T Technology (General) TS Manufactures Low cost, high reliable and robust semiconductor packages are required in order for semiconductor manufacturer to stay competitive in the industry. This requires a stable manufacturing process that able to maintain high production yield, reduce customer reject and scrap cost. Currently, combination of Ni/Pd/AuAg preplated Cu alloy leadframe and Palladium coated copper (PCC) wire is used in the wire bonding process of semiconductor package due to its robustness package performances. Nevertheless,studies on the influence of plating layer thickness of roughened preplated leadframe to the stitch bonding strength of the PCC wire is still lacking and not well understood. The purpose of the current study is to investigate the effect of thickness of AuAg plating (i.e. the top plating layer) of the preplated leadframe on the PCC stitch wire bonding. Regression and ANOVA analysis showed AuAg plating’s thickness of preplated leadframe was the predominant factor on the stitch bonding strength of PCC wire bonding. The bonding force is the second dominant force, followed by the bonding time.However, the DoE results shows AuAg plating thickness has no significant influence (P value >0.05) on the frequency of machine stoppages (i.e. caused by ‘no tail’ and ‘nonstick on lead’ failure on PCC wire stitch bond). Stitch pull strength of PCC wire bonding on the preplated leadframe increased from 10.10 gram-force to 11.20 gram-force,when the AuAg plating’s thickness increased from 7.0 to 35.2 nm. Cross-sectional view micrographs of all the stitch bond samples showed failure mode at stitch bond heel,implied the mechanical failure caused by stitch pull test, may be initiated by crack located at the mechanical deformed wire regions (i.e. stitch bond heel). Lower deformation on bond heel observed with thicker AuAg thickness. This is verified by stitch bond thickness data that exhibited thicker stitch bond heel thicknesses when stitch bonding was performed on leadframe with larger AuAg thickness. Stitch remains’ length increases with larger AuAg thickness because the resulted thicker stitch heels able to withstand higher stitch pull strength, thus elongated further before break up. Thus, both design of experiments and microstructure analysis results supported the stitch pull strength results as function of AuAg plating thickness. Stitch bonding between PCC wire and leadframe was formed through interdiffusion involving Pd species from PCC wire and Au and Ag species from AuAg plating at the bonding interface. Bonded sample with larger AuAg plating thickness exhibited wider interdiffusion zone, thus further strengthened the stitch bond shear strength. This later prevents shear failure at stitch bond interface during stitch pull test. Higher stitch bond strength further strengthens the package reliability. Thus, it enables semiconductor package application extend into automotive industry like power, safety and engine control applications. 2016 Thesis NonPeerReviewed text en http://eprints.utem.edu.my/id/eprint/18372/1/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdf text en http://eprints.utem.edu.my/id/eprint/18372/2/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdf Tey, Sock Chien (2016) Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding. Masters thesis, Universiti Teknikal Malaysia Melaka. https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=100166
institution Universiti Teknikal Malaysia Melaka
building UTEM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknikal Malaysia Melaka
content_source UTEM Institutional Repository
url_provider http://eprints.utem.edu.my/
language English
English
topic T Technology (General)
TS Manufactures
spellingShingle T Technology (General)
TS Manufactures
Tey, Sock Chien
Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding
description Low cost, high reliable and robust semiconductor packages are required in order for semiconductor manufacturer to stay competitive in the industry. This requires a stable manufacturing process that able to maintain high production yield, reduce customer reject and scrap cost. Currently, combination of Ni/Pd/AuAg preplated Cu alloy leadframe and Palladium coated copper (PCC) wire is used in the wire bonding process of semiconductor package due to its robustness package performances. Nevertheless,studies on the influence of plating layer thickness of roughened preplated leadframe to the stitch bonding strength of the PCC wire is still lacking and not well understood. The purpose of the current study is to investigate the effect of thickness of AuAg plating (i.e. the top plating layer) of the preplated leadframe on the PCC stitch wire bonding. Regression and ANOVA analysis showed AuAg plating’s thickness of preplated leadframe was the predominant factor on the stitch bonding strength of PCC wire bonding. The bonding force is the second dominant force, followed by the bonding time.However, the DoE results shows AuAg plating thickness has no significant influence (P value >0.05) on the frequency of machine stoppages (i.e. caused by ‘no tail’ and ‘nonstick on lead’ failure on PCC wire stitch bond). Stitch pull strength of PCC wire bonding on the preplated leadframe increased from 10.10 gram-force to 11.20 gram-force,when the AuAg plating’s thickness increased from 7.0 to 35.2 nm. Cross-sectional view micrographs of all the stitch bond samples showed failure mode at stitch bond heel,implied the mechanical failure caused by stitch pull test, may be initiated by crack located at the mechanical deformed wire regions (i.e. stitch bond heel). Lower deformation on bond heel observed with thicker AuAg thickness. This is verified by stitch bond thickness data that exhibited thicker stitch bond heel thicknesses when stitch bonding was performed on leadframe with larger AuAg thickness. Stitch remains’ length increases with larger AuAg thickness because the resulted thicker stitch heels able to withstand higher stitch pull strength, thus elongated further before break up. Thus, both design of experiments and microstructure analysis results supported the stitch pull strength results as function of AuAg plating thickness. Stitch bonding between PCC wire and leadframe was formed through interdiffusion involving Pd species from PCC wire and Au and Ag species from AuAg plating at the bonding interface. Bonded sample with larger AuAg plating thickness exhibited wider interdiffusion zone, thus further strengthened the stitch bond shear strength. This later prevents shear failure at stitch bond interface during stitch pull test. Higher stitch bond strength further strengthens the package reliability. Thus, it enables semiconductor package application extend into automotive industry like power, safety and engine control applications.
format Thesis
author Tey, Sock Chien
author_facet Tey, Sock Chien
author_sort Tey, Sock Chien
title Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding
title_short Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding
title_full Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding
title_fullStr Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding
title_full_unstemmed Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding
title_sort influence of gold silver plating thickness on palladium coated copper wire on stitch bonding
publishDate 2016
url http://eprints.utem.edu.my/id/eprint/18372/1/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdf
http://eprints.utem.edu.my/id/eprint/18372/2/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdf
http://eprints.utem.edu.my/id/eprint/18372/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=100166
_version_ 1715193894165020672
score 13.211869

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