Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process
A typical element found in electronic assemblies and devices is the multi-layered ceramic capacitor (MLCC). However, MLCC mechanical defects such as voiding, cracking, and delamination would significantly reduce the device's usefulness, dependability, and longevity. This mechanical defect is on...
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| 主要作者: | |
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| 格式: | Monograph |
| 語言: | English |
| 出版: |
Universiti Sains Malaysia
2022
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| 在線閱讀: | http://eprints.usm.my/55718/1/Study%20Of%20Deformation%20And%20Crack%20Propagation%20On%20Component%20During%20Reflow%20Soldering%20Process_Hehgeraj%20Raja%20Gobal.pdf http://eprints.usm.my/55718/ |
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