APA引文

Raja Gobal, H. (2022). Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process. Universiti Sains Malaysia.

Chicago Style Citation

Raja Gobal, Hehgeraj. Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process. Universiti Sains Malaysia, 2022.

MLA引文

Raja Gobal, Hehgeraj. Study Of Deformation And Crack Propagation On Component During Reflow Soldering Process. Universiti Sains Malaysia, 2022.

警告：这些引文格式不一定是100％准确.