Development of vapor pressure in FR4-copper composite material during solder reflow process
This paper presents a finite element (FE) methodology for predicting the distribution of vapor pressure in a simple FR4-copper composite material when it is heated up to 215°C. A general purpose finite element software was used to develop a two-dimensional plane strain model of the composite materia...
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| Main Authors: | , , , , |
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| Format: | Book Section |
| Published: |
American Institute of Physics
2012
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/35239/ http://dx.doi.org/10.1063/1.4704209 |
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