Influence Of Material Properties On The Aperture Filling During Stencil Printing Process
High requirement of smaller size, lighter weight, and high performance Printed Circuit Board (PCB) in electronic packaging has contributed to the wide application of stencil printing for soldering process. Stencil printing offers good consistency of soldering performance as well as produce larger...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2018
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| Online Access: | http://eprints.usm.my/54299/1/Influence%20Of%20Material%20Properties%20On%20The%20Aperture%20Filling%20During%20Stencil%20Printing%20Process_Muhammad%20Farid%20Mohamad%20Rafdzi_M4_2018.pdf http://eprints.usm.my/54299/ |
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