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Influence Of Material Properties On The Aperture Filling During Stencil Printing Process

High requirement of smaller size, lighter weight, and high performance Printed Circuit Board (PCB) in electronic packaging has contributed to the wide application of stencil printing for soldering process. Stencil printing offers good consistency of soldering performance as well as produce larger...

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Main Author: Mohamad Rafdzi, Muhammad Farid
Format: Monograph
Language:English
Published: Universiti Sains Malaysia 2018
Subjects:
T Technology
TJ Mechanical engineering and machinery
Online Access:http://eprints.usm.my/54299/1/Influence%20Of%20Material%20Properties%20On%20The%20Aperture%20Filling%20During%20Stencil%20Printing%20Process_Muhammad%20Farid%20Mohamad%20Rafdzi_M4_2018.pdf
http://eprints.usm.my/54299/
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spelling my.usm.eprints.54299 http://eprints.usm.my/54299/ Influence Of Material Properties On The Aperture Filling During Stencil Printing Process Mohamad Rafdzi, Muhammad Farid T Technology TJ Mechanical engineering and machinery High requirement of smaller size, lighter weight, and high performance Printed Circuit Board (PCB) in electronic packaging has contributed to the wide application of stencil printing for soldering process. Stencil printing offers good consistency of soldering performance as well as produce larger process output at short time that make it one of the best option for high volume application in Surface Mount Technology (SMT). However, the soldering method also contributes to major percentage of soldering defect compared to other methods which is necessary to be addressed through research and development. One of the common defects due to the stencil printing is regarding to the printing quality of solder paste on substrate such as PCB with respect to the variation of process parameters. Uncontrolled process parameters cause the soldering defects such as solder bridging that can lead to product failure in further processes in production line. An experiment has been conducted to analyse the influence of material properties on the aperture filling during solder printing process. The studied parameters are the printing speed, printing load and the printing direction. The study had found that the printing speed 35mm/s to 45mm/s has potential to obtain good print quality of solder filling. Printing load of 8kg to 9kg shows the good printing load option to achieve good print quality in stencil printing process. Finally, the reverse direction of printing mode shows a better quality compared to forward direction of printing mode. Universiti Sains Malaysia 2018-06-01 Monograph NonPeerReviewed application/pdf en http://eprints.usm.my/54299/1/Influence%20Of%20Material%20Properties%20On%20The%20Aperture%20Filling%20During%20Stencil%20Printing%20Process_Muhammad%20Farid%20Mohamad%20Rafdzi_M4_2018.pdf Mohamad Rafdzi, Muhammad Farid (2018) Influence Of Material Properties On The Aperture Filling During Stencil Printing Process. Project Report. Universiti Sains Malaysia, Pusat Pengajian Kejuruteraan Mekanikal. (Submitted)
institution Universiti Sains Malaysia
building Hamzah Sendut Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Sains Malaysia
content_source USM Institutional Repository
url_provider http://eprints.usm.my/
language English
topic T Technology
TJ Mechanical engineering and machinery
spellingShingle T Technology
TJ Mechanical engineering and machinery
Mohamad Rafdzi, Muhammad Farid
Influence Of Material Properties On The Aperture Filling During Stencil Printing Process
description High requirement of smaller size, lighter weight, and high performance Printed Circuit Board (PCB) in electronic packaging has contributed to the wide application of stencil printing for soldering process. Stencil printing offers good consistency of soldering performance as well as produce larger process output at short time that make it one of the best option for high volume application in Surface Mount Technology (SMT). However, the soldering method also contributes to major percentage of soldering defect compared to other methods which is necessary to be addressed through research and development. One of the common defects due to the stencil printing is regarding to the printing quality of solder paste on substrate such as PCB with respect to the variation of process parameters. Uncontrolled process parameters cause the soldering defects such as solder bridging that can lead to product failure in further processes in production line. An experiment has been conducted to analyse the influence of material properties on the aperture filling during solder printing process. The studied parameters are the printing speed, printing load and the printing direction. The study had found that the printing speed 35mm/s to 45mm/s has potential to obtain good print quality of solder filling. Printing load of 8kg to 9kg shows the good printing load option to achieve good print quality in stencil printing process. Finally, the reverse direction of printing mode shows a better quality compared to forward direction of printing mode.
format Monograph
author Mohamad Rafdzi, Muhammad Farid
author_facet Mohamad Rafdzi, Muhammad Farid
author_sort Mohamad Rafdzi, Muhammad Farid
title Influence Of Material Properties On The Aperture Filling During Stencil Printing Process
title_short Influence Of Material Properties On The Aperture Filling During Stencil Printing Process
title_full Influence Of Material Properties On The Aperture Filling During Stencil Printing Process
title_fullStr Influence Of Material Properties On The Aperture Filling During Stencil Printing Process
title_full_unstemmed Influence Of Material Properties On The Aperture Filling During Stencil Printing Process
title_sort influence of material properties on the aperture filling during stencil printing process
publisher Universiti Sains Malaysia
publishDate 2018
url http://eprints.usm.my/54299/1/Influence%20Of%20Material%20Properties%20On%20The%20Aperture%20Filling%20During%20Stencil%20Printing%20Process_Muhammad%20Farid%20Mohamad%20Rafdzi_M4_2018.pdf
http://eprints.usm.my/54299/
_version_ 1743107811518185472
score 13.211869

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