Variability reduction in stencil printing of solder paste for surface mount technology
Competition in stencil printing to produce excellence in the finished product is intense. Faults in the printing process are a major source of board failure. Studies have shown that over 63% of defects identified after reDow originated from the solder paste printing ( A. Lotfi ,1998 ) . Howeve...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
1998
|
| Subjects: | |
| Online Access: | http://eprints.uthm.edu.my/7697/1/24p%20MUSTAFFA%20IBRAHIM.pdf http://eprints.uthm.edu.my/7697/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|