Formation of thick spin-on glass (SOG) sacrificial layer for capacitive accelerometer encapsulation
This paper presents a method to form thick spin-on glass (SOG) sacrificial layer for accelerometer encapsulation fabrication. Siloxane type SOG is applied on blank wafers and accelerometer patterns by multiple spin, bake, and cure processes. A series of gradual hot plate baking up to 250°C are exper...
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2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5319 |
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