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Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometer

This paper discusses sputtered silicon encapsulation as a wafer level packaging approach for isolatable MEMS devices. Devices such as accelerometers, RF switches, inductors, and filters that do not require interaction with the surroundings to function, could thus be fully encapsulated at the wafer l...

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Main Authors:	Hamzah, A.A., Yunas, J., Majlis, B.Y., Ahmad, I.
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出版:	2017
在線閱讀:	http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5281
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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