Hamzah, A. (2017). Sputtered encapsulation as wafer level packaging for isolatable MEMS devices: A technique demonstrated on a capacitive accelerometer.
Chicago Style CitationHamzah, A.A. Sputtered Encapsulation As Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated On a Capacitive Accelerometer. 2017.
MLA CitationHamzah, A.A. Sputtered Encapsulation As Wafer Level Packaging for Isolatable MEMS Devices: A Technique Demonstrated On a Capacitive Accelerometer. 2017.
Warning: These citations may not always be 100% accurate.