Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
The electronic industry faces a number of issues as a result of the rapid miniaturization of electronic products and the expansion of application areas, with the reliability of electronic packaging materials playing a significant role. Moreover, the continuously harsh service conditions of electroni...
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2024
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my.uniten.dspace-341522024-10-14T11:18:10Z Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies Dele-Afolabi T.T. Ansari M.N.M. Azmah Hanim M.A. Oyekanmi A.A. Ojo-Kupoluyi O.J. Atiqah A. 56225674500 55489853600 24723635600 57194067040 57193319922 55366998300 Energy ENImAg surface finish Interlayer components Intermetallic compounds Rotary magnetic field Sn-based solder Electronics packaging Finishing Intermetallics Lead-free solders Microelectronics Packaging materials Reliability Soldering Temperature Electronics products Energy ENImAg surface finish Interlayer component Intermetallics compounds Magnetic-field Rotary magnetic field Sn-based solders Solder joints Surface finishes Magnetic fields The electronic industry faces a number of issues as a result of the rapid miniaturization of electronic products and the expansion of application areas, with the reliability of electronic packaging materials playing a significant role. Moreover, the continuously harsh service conditions of electronic products like high current density and excessive Joule heat will lead to severe reliability concerns of electromigration and thermomigration, which evidently curtail the lifespan of solder joints. Therefore, to maintain the reliability of solder joints in recent microelectronic applications, several investigations have been conducted in the last decade to proffer solutions to the drawbacks affecting the full implementation of the Sn-based solders in advanced packaging technologies. This article reviews the recent developments on the reliability investigation of Sn-based solder joints and discusses the influence of interlayer materials, electroless nickel immersion silver (ENImAg) surface finish, geopolymer ceramics and rotary magnetic field (RMF) technology. The 3D network structure of porous interlayer metals and the beneficial features of ENImAg surface finish have demonstrated to be highly efficient in revamping existing lead-free solders by satisfying the needs of both high-temperature service operation and low-temperature soldering. While transient current bonding technology is efficient at preventing agglomeration and floating of nano-sized reinforcements in composite solders, RMF technology is effective in controlling the flow and solidification of liquid metal during the soldering process. Finally, emerging technologies for future research directions have been summarized to provide further theoretical basis required for the investigation of solder joint reliability of electronic devices in service. � 2023 The Authors Final 2024-10-14T03:18:10Z 2024-10-14T03:18:10Z 2023 Review 10.1016/j.jmrt.2023.06.193 2-s2.0-85164242586 https://www.scopus.com/inward/record.uri?eid=2-s2.0-85164242586&doi=10.1016%2fj.jmrt.2023.06.193&partnerID=40&md5=ed6158b7e86de1188662355552dbb664 https://irepository.uniten.edu.my/handle/123456789/34152 25 4231 4263 All Open Access Gold Open Access Elsevier Editora Ltda Scopus |
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Energy ENImAg surface finish Interlayer components Intermetallic compounds Rotary magnetic field Sn-based solder Electronics packaging Finishing Intermetallics Lead-free solders Microelectronics Packaging materials Reliability Soldering Temperature Electronics products Energy ENImAg surface finish Interlayer component Intermetallics compounds Magnetic-field Rotary magnetic field Sn-based solders Solder joints Surface finishes Magnetic fields |
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Energy ENImAg surface finish Interlayer components Intermetallic compounds Rotary magnetic field Sn-based solder Electronics packaging Finishing Intermetallics Lead-free solders Microelectronics Packaging materials Reliability Soldering Temperature Electronics products Energy ENImAg surface finish Interlayer component Intermetallics compounds Magnetic-field Rotary magnetic field Sn-based solders Solder joints Surface finishes Magnetic fields Dele-Afolabi T.T. Ansari M.N.M. Azmah Hanim M.A. Oyekanmi A.A. Ojo-Kupoluyi O.J. Atiqah A. Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies |
| description |
The electronic industry faces a number of issues as a result of the rapid miniaturization of electronic products and the expansion of application areas, with the reliability of electronic packaging materials playing a significant role. Moreover, the continuously harsh service conditions of electronic products like high current density and excessive Joule heat will lead to severe reliability concerns of electromigration and thermomigration, which evidently curtail the lifespan of solder joints. Therefore, to maintain the reliability of solder joints in recent microelectronic applications, several investigations have been conducted in the last decade to proffer solutions to the drawbacks affecting the full implementation of the Sn-based solders in advanced packaging technologies. This article reviews the recent developments on the reliability investigation of Sn-based solder joints and discusses the influence of interlayer materials, electroless nickel immersion silver (ENImAg) surface finish, geopolymer ceramics and rotary magnetic field (RMF) technology. The 3D network structure of porous interlayer metals and the beneficial features of ENImAg surface finish have demonstrated to be highly efficient in revamping existing lead-free solders by satisfying the needs of both high-temperature service operation and low-temperature soldering. While transient current bonding technology is efficient at preventing agglomeration and floating of nano-sized reinforcements in composite solders, RMF technology is effective in controlling the flow and solidification of liquid metal during the soldering process. Finally, emerging technologies for future research directions have been summarized to provide further theoretical basis required for the investigation of solder joint reliability of electronic devices in service. � 2023 The Authors |
| author2 |
56225674500 |
| author_facet |
56225674500 Dele-Afolabi T.T. Ansari M.N.M. Azmah Hanim M.A. Oyekanmi A.A. Ojo-Kupoluyi O.J. Atiqah A. |
| format |
Review |
| author |
Dele-Afolabi T.T. Ansari M.N.M. Azmah Hanim M.A. Oyekanmi A.A. Ojo-Kupoluyi O.J. Atiqah A. |
| author_sort |
Dele-Afolabi T.T. |
| title |
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies |
| title_short |
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies |
| title_full |
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies |
| title_fullStr |
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies |
| title_full_unstemmed |
Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies |
| title_sort |
recent advances in sn-based lead-free solder interconnects for microelectronics packaging: materials and technologies |
| publisher |
Elsevier Editora Ltda |
| publishDate |
2024 |
| _version_ |
1814061043729563648 |
| score |
13.222552 |