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Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition

The effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method were studied in this paper. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were sele...

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Main Authors:	Harif M.N., Ahmad I.
Other Authors:	22634024000
Format:	Conference paper
Published:	2023
Subjects:	Lead free Pull test and IMC thicknesses Solder joint Chip scale packages Intermetallics Materials Mechanical properties Semiconductor growth Silver Soldering alloys Spheres Testing Thermoelectric equipment Units of measurement After high temperature High temperature storage High-power Image analyzers IMC thickness Intermetallic compounds Intermetallic thickness Joint effect Joint reliability Joint strength Lead-Free Lead-free solder joint Per unit Pull strength Sample sizes Semiconductor packaging Sn-3.5Ag Sn3.5Ag solder Solder joints Solder-joint strength Statistical analysis Test data Test machine Test method Test results Thermal condition Thermal condition tests Lead
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spelling	my.uniten.dspace-307362023-12-29T15:52:09Z Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition Harif M.N. Ahmad I. 22634024000 12792216600 Lead free Pull test and IMC thicknesses Solder joint Chip scale packages Intermetallics Materials Mechanical properties Semiconductor growth Silver Soldering alloys Spheres Testing Thermoelectric equipment Units of measurement After high temperature High temperature storage High-power Image analyzers IMC thickness Intermetallic compounds Intermetallic thickness Joint effect Joint reliability Joint strength Lead-Free Lead-free solder joint Per unit Pull strength Sample sizes Semiconductor packaging Sn-3.5Ag Sn3.5Ag solder Solder joints Solder-joint strength Statistical analysis Test data Test machine Test method Test results Thermal condition Thermal condition tests Lead The effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method were studied in this paper. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387), Sn2.3Ag0.08Ni0.01Co (SANC), and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contain 8 balls. From all the samples, result shows that the mean pull strength for high temperature storage are 2847.66g, 2628.20g and 2613.79g for Sn3.5Ag, SANC and SAC387 respectively. Thus Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, intermetallic compound (IMC) thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit, and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139?m, 2.3111 ?m and 2.3931 ?m. It was found that IMC thickness for SANC and Sn3.5Ag does not show significant growth after high temperature storage but SAC387 demonstrated significant growth. Lower intermetallic thickness implies less brittle joint effect, thus from this part of study, better joint reliability is expected for the Sn3.5Ag solder system. In summary pull test method is feasible to be used in characterization in terms of solder joint strength of lead free solder joint material for semiconductor packaging. It also determined ball pull test results provide correlation of the IMC thickness and solder joint strength material. �2010 IEEE. Final 2023-12-29T07:52:08Z 2023-12-29T07:52:08Z 2010 Conference paper 10.1109/ICEDSA.2010.5503049 2-s2.0-77955288873 https://www.scopus.com/inward/record.uri?eid=2-s2.0-77955288873&doi=10.1109%2fICEDSA.2010.5503049&partnerID=40&md5=632eb6991dc7d96f9f3bafd64bfcd8bc https://irepository.uniten.edu.my/handle/123456789/30736 5503049 331 334 Scopus
institution	Universiti Tenaga Nasional
building	UNITEN Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Tenaga Nasional
content_source	UNITEN Institutional Repository
url_provider	http://dspace.uniten.edu.my/
topic	Lead free Pull test and IMC thicknesses Solder joint Chip scale packages Intermetallics Materials Mechanical properties Semiconductor growth Silver Soldering alloys Spheres Testing Thermoelectric equipment Units of measurement After high temperature High temperature storage High-power Image analyzers IMC thickness Intermetallic compounds Intermetallic thickness Joint effect Joint reliability Joint strength Lead-Free Lead-free solder joint Per unit Pull strength Sample sizes Semiconductor packaging Sn-3.5Ag Sn3.5Ag solder Solder joints Solder-joint strength Statistical analysis Test data Test machine Test method Test results Thermal condition Thermal condition tests Lead
spellingShingle	Lead free Pull test and IMC thicknesses Solder joint Chip scale packages Intermetallics Materials Mechanical properties Semiconductor growth Silver Soldering alloys Spheres Testing Thermoelectric equipment Units of measurement After high temperature High temperature storage High-power Image analyzers IMC thickness Intermetallic compounds Intermetallic thickness Joint effect Joint reliability Joint strength Lead-Free Lead-free solder joint Per unit Pull strength Sample sizes Semiconductor packaging Sn-3.5Ag Sn3.5Ag solder Solder joints Solder-joint strength Statistical analysis Test data Test machine Test method Test results Thermal condition Thermal condition tests Lead Harif M.N. Ahmad I. Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition
description	The effect of high temperature storage (HTS) on lead free solder joint material for ball grid array application using pull test method were studied in this paper. Some statistical analysis base on the pull test data also discussed. Three samples of different lead free solder joint material were selected in this experiment namely Sn3.8Ag0.7Cu (SAC387), Sn2.3Ag0.08Ni0.01Co (SANC), and Sn3.5Ag. After the thermal condition test, all the lead free solder joint material samples were tested using Dage 4000 pull test machine. Each pull test will be 5 units and each unit contain 8 balls. From all the samples, result shows that the mean pull strength for high temperature storage are 2847.66g, 2628.20g and 2613.79g for Sn3.5Ag, SANC and SAC387 respectively. Thus Sn3.5Ag shows a significantly better solder joint performance in terms of joint strength compare to SANC and SAC387. Hence, intermetallic compound (IMC) thicknesses were measured after cross-sectioning. Sample size for cross-sectioning was 3 units per read point, 2 balls per unit, and 3 maximum IMC peaks per ball and the measurement using high power scope of 100x and Image Analyzer software to measure the IMC thickness. For high temperature storage, result show that the mean IMC thicknesses for SAC387, SANC and Sn3.5Ag are 3.9139?m, 2.3111 ?m and 2.3931 ?m. It was found that IMC thickness for SANC and Sn3.5Ag does not show significant growth after high temperature storage but SAC387 demonstrated significant growth. Lower intermetallic thickness implies less brittle joint effect, thus from this part of study, better joint reliability is expected for the Sn3.5Ag solder system. In summary pull test method is feasible to be used in characterization in terms of solder joint strength of lead free solder joint material for semiconductor packaging. It also determined ball pull test results provide correlation of the IMC thickness and solder joint strength material. �2010 IEEE.
author2	22634024000
author_facet	22634024000 Harif M.N. Ahmad I.
format	Conference paper
author	Harif M.N. Ahmad I.
author_sort	Harif M.N.
title	Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition
title_short	Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition
title_full	Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition
title_fullStr	Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition
title_full_unstemmed	Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition
title_sort	mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition
publishDate	2023
_version_	1806425709633077248
score	13.211869

Mechanical properties study of lead free solder joint material used in semiconductor packaging subjected to thermal condition

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