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Study on reliability test of die attach material

Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing prob...

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Main Authors:	Yik L.C., Kar Y.B., Shafika N.
Other Authors:	55787504300
Format:	Conference paper
Published:	2023
Subjects:	copper filler reliability silver test method Fillers Industrial electronics Manufacture Reliability Silver Silver plating Testing Die attachment Die-attach materials Packaging companies Reliability test Test method Copper
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id	my.uniten.dspace-29533
record_format	dspace
spelling	my.uniten.dspace-295332023-12-28T14:30:24Z Study on reliability test of die attach material Yik L.C. Kar Y.B. Shafika N. 55787504300 26649255900 55786831000 copper filler reliability silver test method Fillers Industrial electronics Manufacture Reliability Silver Silver plating Testing Die attachment Die-attach materials Packaging companies Reliability test Test method Copper Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing problem. But the characteristic and reliability of silver plated copper filler has be a doubt to replace the pure silver in the market. This paper will review few test method to test on the reliability of silver plated copper filler and proved that it is as good as silver to be the filler. � 2012 IEEE. Final 2023-12-28T06:30:24Z 2023-12-28T06:30:24Z 2012 Conference paper 10.1109/IEMT.2012.6521776 2-s2.0-84879853139 https://www.scopus.com/inward/record.uri?eid=2-s2.0-84879853139&doi=10.1109%2fIEMT.2012.6521776&partnerID=40&md5=e78d451874fd582012de2c1aa00d2661 https://irepository.uniten.edu.my/handle/123456789/29533 6521776 Scopus
institution	Universiti Tenaga Nasional
building	UNITEN Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Tenaga Nasional
content_source	UNITEN Institutional Repository
url_provider	http://dspace.uniten.edu.my/
topic	copper filler reliability silver test method Fillers Industrial electronics Manufacture Reliability Silver Silver plating Testing Die attachment Die-attach materials Packaging companies Reliability test Test method Copper
spellingShingle	copper filler reliability silver test method Fillers Industrial electronics Manufacture Reliability Silver Silver plating Testing Die attachment Die-attach materials Packaging companies Reliability test Test method Copper Yik L.C. Kar Y.B. Shafika N. Study on reliability test of die attach material
description	Silver plated copper is a new developed die attachment material to replace pure silver. As year past, price of silver getting higher and become a problem for those semiconductors packaging company. Therefore, silver plated copper was developed as new die attachment material to solve the costing problem. But the characteristic and reliability of silver plated copper filler has be a doubt to replace the pure silver in the market. This paper will review few test method to test on the reliability of silver plated copper filler and proved that it is as good as silver to be the filler. � 2012 IEEE.
author2	55787504300
author_facet	55787504300 Yik L.C. Kar Y.B. Shafika N.
format	Conference paper
author	Yik L.C. Kar Y.B. Shafika N.
author_sort	Yik L.C.
title	Study on reliability test of die attach material
title_short	Study on reliability test of die attach material
title_full	Study on reliability test of die attach material
title_fullStr	Study on reliability test of die attach material
title_full_unstemmed	Study on reliability test of die attach material
title_sort	study on reliability test of die attach material
publishDate	2023
_version_	1806424443596046336
score	13.222552

Study on reliability test of die attach material

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