Symmetrical unit-cell numerical approach for flip-chip underfill flow simulation
Underfill process is a critical manufacturing process to safeguard and enhance the package reliability of flip-chip devices. In most underfill researches, the underfill flow was primarily investigated through numerical simulation. Nonetheless, the numerical simulation required a tremendously long ti...
Saved in:
| Main Authors: | , , , , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Published: |
Penerbit Akademia Baru
2023
|
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|