Comments: Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding

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Bibliographic Details
Main Authors:	R., Izamshah, N., Suieb, M. S., Kasim, M. S., A. Aziz, M. S., Yob, S. A., Sundi, R., Zamri, R. S. A., Abdullah
Other Authors:	izamshah@utem.edu.my
Format:	Article
Language:	English
Published:	Universiti Malaysia Perlis (UniMAP) 2022
Subjects:	Electroplating Manufacturing process Physical shielding Precision engineering
Online Access:	http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75798
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