Optimizing Electroplating Process Parameter And Sn-Plating Thickness Uniformity Using Modified Shielding
Uneven plating thickness distribution across plated surface has become a major challenge in electroplating industry even for advanced plating technology today due to complexity of package design. LPL HD package encounter low plating thickness on the heatsink area, but thicker on lead area. Due to th...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2020
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/25581/2/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf http://eprints.utem.edu.my/id/eprint/25581/3/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf http://eprints.utem.edu.my/id/eprint/25581/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119193 |
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http://eprints.utem.edu.my/id/eprint/25581/2/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdfhttp://eprints.utem.edu.my/id/eprint/25581/3/Optimizing%20Electroplating%20Process%20Parameter%20And%20Sn-Plating%20Thickness%20Uniformity%20Using%20Modified%20Shielding.pdf
http://eprints.utem.edu.my/id/eprint/25581/
https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=119193