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Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding

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Main Authors: R., Izamshah, N., Suieb, M. S., Kasim, M. S., A. Aziz, M. S., Yob, S. A., Sundi, R., Zamri, R. S. A., Abdullah
Other Authors: izamshah@utem.edu.my
Format: Article
Language:English
Published: Universiti Malaysia Perlis (UniMAP) 2022
Subjects:
Electroplating
Manufacturing process
Physical shielding
Precision engineering
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75798
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spelling my.unimap-757982022-08-07T03:30:48Z Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding R., Izamshah R., Izamshah N., Suieb M. S., Kasim M. S., A. Aziz M. S., Yob S. A., Sundi R., Zamri R. S. A., Abdullah izamshah@utem.edu.my Advanced Manufacturing Centre (AMC), Universiti Teknikal Malaysia Melaka (UTeM) Faculty of Manufacturing Engineering, Universiti Teknikal Malaysia Melaka (UTeM) Fakulti Teknologi Kejuruteraan Mekanikal dan Pembuatan, Universiti Teknikal Malaysia Melaka (UTeM) School of Information Technology and Electrical Engineering, The University of Queensland Electroplating Manufacturing process Physical shielding Precision engineering Link to publisher's homepage at http://ijneam.unimap.edu.my Uneven plating thickness distribution across plated surface has become a major challenge in electroplating industry mainly due to the complexity of package design. In most cases, controlling the plating thickness uniformity to the specific area according to the required package design specification can be a challenging task for the manufacturer which can result in high losses. The plating thickness uniformity are closely related with the electroplating process parameter and the passage of current between anodes to cathode. To deal with the current passage, a shielding technique that control the disposed area between the anode and cathode can be an effective way. Therefore, the aim of this paper is to study the electroplating process parameters (current and speed) for improving the Sn-plating thickness uniformity using modified mechanical shielding. Taguchi method is adopted to reduce the size of experiment and optimize the process parameters simultaneously. As a result, new parameter has been established which offer ideal plating thickness with less variation and stable Cpk. From the conducted experimental work, it shows that by employing the right physical resistance shielding aperture able to selectively alter or modulate the electric fields between the anode and the plating surface on the embodiment and thereby control the electro deposition rate across the area of the plating surface. 2022 2022-08-07T03:30:48Z 2022-08-07T03:30:48Z 2022-03 Article International Journal of Nanoelectronics and Materials, vol.15 (Special Issue), 2022, pages 233-245 1985-5761 (Printed) 1997-4434 (Online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75798 http://ijneam.unimap.edu.my en Special Issue ISSTE 2022; Universiti Malaysia Perlis (UniMAP)
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Electroplating
Manufacturing process
Physical shielding
Precision engineering
spellingShingle Electroplating
Manufacturing process
Physical shielding
Precision engineering
R., Izamshah
R., Izamshah
N., Suieb
M. S., Kasim
M. S., A. Aziz
M. S., Yob
S. A., Sundi
R., Zamri
R. S. A., Abdullah
Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
description Link to publisher's homepage at http://ijneam.unimap.edu.my
author2 izamshah@utem.edu.my
author_facet izamshah@utem.edu.my
R., Izamshah
R., Izamshah
N., Suieb
M. S., Kasim
M. S., A. Aziz
M. S., Yob
S. A., Sundi
R., Zamri
R. S. A., Abdullah
format Article
author R., Izamshah
R., Izamshah
N., Suieb
M. S., Kasim
M. S., A. Aziz
M. S., Yob
S. A., Sundi
R., Zamri
R. S. A., Abdullah
author_sort R., Izamshah
title Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
title_short Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
title_full Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
title_fullStr Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
title_full_unstemmed Optimizing electroplating process parameter and Sn-Plating thickness uniformity using modified shielding
title_sort optimizing electroplating process parameter and sn-plating thickness uniformity using modified shielding
publisher Universiti Malaysia Perlis (UniMAP)
publishDate 2022
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/75798
_version_ 1743108376467865600
score 13.222552

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