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Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder

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Main Authors: Mohd Izrul Izwan, Ramli, ‪Mohd Arif Anuar, Mohd Salleh, Mohd Nazree, Derman, Rita, Mohd Said, Norainiza, Saud
Other Authors: mohdizrulizwan@gmail.com
Format: Article
Language:English
Published: EDP Sciences 2020
Subjects:
Activated Carbon (AC)
Intermetallic compound
Solder
Online Access:http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68728
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spelling my.unimap-687282020-11-16T04:23:43Z Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder Mohd Izrul Izwan, Ramli ‪Mohd Arif Anuar, Mohd Salleh Mohd Nazree, Derman Rita, Mohd Said Norainiza, Saud mohdizrulizwan@gmail.com Activated Carbon (AC) Intermetallic compound Solder Link to publisher's homepage at https://www.matec-conferences.org/ The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. %, and 1.0 wt. %) were prepared via powder metallurgy (PM) technique. Interfacial IMC thickness measurement and shear strength results showed that with thinner IMC layer (by increasing amount of wt.% of AC), the higher the shear strength of the joint. It is believed that the AC particles suppresses the interfacial IMC growth and thus improves the shear strength. 2020-11-16T04:23:43Z 2020-11-16T04:23:43Z 2016-10 Article MATEC Web Conferences, vol.78, 2016, 7 pages 2261-236X (online) http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68728 https://doi.org/10.1051/matecconf/20167801064 en 2nd International Conference on Green Design and Manufacture 2016 (IConGDM 2016); EDP Sciences
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Activated Carbon (AC)
Intermetallic compound
Solder
spellingShingle Activated Carbon (AC)
Intermetallic compound
Solder
Mohd Izrul Izwan, Ramli
‪Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman
Rita, Mohd Said
Norainiza, Saud
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
description Link to publisher's homepage at https://www.matec-conferences.org/
author2 mohdizrulizwan@gmail.com
author_facet mohdizrulizwan@gmail.com
Mohd Izrul Izwan, Ramli
‪Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman
Rita, Mohd Said
Norainiza, Saud
format Article
author Mohd Izrul Izwan, Ramli
‪Mohd Arif Anuar, Mohd Salleh
Mohd Nazree, Derman
Rita, Mohd Said
Norainiza, Saud
author_sort Mohd Izrul Izwan, Ramli
title Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
title_short Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
title_full Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
title_fullStr Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
title_full_unstemmed Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
title_sort influence of activated carbon particles on intermetallic compound growth mechanism in sn-cu-ni composite solder
publisher EDP Sciences
publishDate 2020
url http://dspace.unimap.edu.my:80/xmlui/handle/123456789/68728
_version_ 1698698502329073664
score 13.222552

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