Mohd Izrul Izwan, R., & mohdizrulizwan@gmail.com. (2020). Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder. EDP Sciences.
Chicago Style CitationMohd Izrul Izwan, Ramli, and mohdizrulizwan@gmail.com. Influence of Activated Carbon Particles On Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder. EDP Sciences, 2020.
MLA引文Mohd Izrul Izwan, Ramli, and mohdizrulizwan@gmail.com. Influence of Activated Carbon Particles On Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder. EDP Sciences, 2020.
警告：这些引文格式不一定是100％准确.