Dicing die attach film for 3D stacked die QFN packages
Proceedings of the 32nd IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium 2007 at San Jose, CA, United States on 3 October 2007 through 5 October 2007. Link to publisher's homepage at http://ezproxy.unimap.edu.my:2080/Xplore/dynhome.jsp?tag=1
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| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Working Paper |
| Language: | English |
| Published: |
IEEE Conference Publications
2014
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| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/35213 |
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