Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
Full text of this article is also available at http://mechanical.eng.um.edu.my/
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Department of Mechanical Engineering, University Malaya
2008
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| Subjects: | |
| Online Access: | http://dspace.unimap.edu.my/xmlui/handle/123456789/3506 |
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