Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life
Link to publisher's homepage at http://www.emeraldinsight.com/
Saved in:
| Main Authors: | , , , , , |
|---|---|
| 其他作者: | |
| 格式: | Article |
| 語言: | English |
| 出版: |
Emerald Group Publishing
2014
|
| 主題: | |
| 在線閱讀: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/33853 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|