Lee, K. O., & ishak@eng.usm.my. (2014). Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life. Emerald Group Publishing.
Chicago Style CitationLee, Kor Oon, and ishak@eng.usm.my. Application of Artificial Intelligence for the Determination of Package Parameters for a Desired Solder Joint Fatigue Life. Emerald Group Publishing, 2014.
MLA引文Lee, Kor Oon, and ishak@eng.usm.my. Application of Artificial Intelligence for the Determination of Package Parameters for a Desired Solder Joint Fatigue Life. Emerald Group Publishing, 2014.
警告：這些引文格式不一定是100％准確.