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Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package

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Main Authors: Chong, Leong Gan, Uda
Other Authors: chong-leong.gan@spansion.com
Format: Article
Language:English
Published: Springer Science+Business Media New York 2014
Subjects:
Component reliability
Reliability assessments
Mechanical characterizations
High temperature storage lives
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33099
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spelling my.unimap-330992014-03-25T04:56:48Z Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package Chong, Leong Gan Uda chong-leong.gan@spansion.com clgan_pgg@yahoo.com uda@unimap.edu.my Component reliability Reliability assessments Mechanical characterizations High temperature storage lives Link to publisher's homepage at http://link.springer.com/ Extended reliability and mechanical characterisation of Au and Pd-coated Cu (Cu) ball bonds are useful technical information for Au and Cu wire deployment in semiconductor device packaging. This paper discusses the influence of wire type on the package reliability and mechanical performance after several component reliability stress tests. Failure analysis has been conducted to identify the associated failure mechanisms of Au and Cu ball bonds after reliability tests. Wire pull strength and ball bond shear (with its break modes) of both wire types are investigated after unbiased highly accelerated temperature and humidity stress test (UHAST), temperature cycling (TC) and high temperature storage life test (HTSL) at various aging temperatures. Reliability Weibull plots have been plotted for each reliability stresses. Obviously Au ball bond is found with longer time-to-failure in Unbiased HAST stress compare to Cu ball bonds. Cu wire exhibits equivalent package and or better reliability margin compare to Au ball bonds in TC and HTSL tests. Failure mechanisms of UHAST and HTSL have been proposed and its mean-time-to failure (t50), characteristics life (t63.2, η) and shape parameter (ß) have been discussed in this paper. 2014-03-25T04:56:48Z 2014-03-25T04:56:48Z 2013-08 Article Journal of Materials Science: Materials in Electronics, vol. 24(8), 2013, pages 2803-2811 0957-4522 http://link.springer.com/article/10.1007%2Fs10854-013-1174-6 http://dspace.unimap.edu.my:80/dspace/handle/123456789/33099 en Springer Science+Business Media New York
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Component reliability
Reliability assessments
Mechanical characterizations
High temperature storage lives
spellingShingle Component reliability
Reliability assessments
Mechanical characterizations
High temperature storage lives
Chong, Leong Gan
Uda
Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
description Link to publisher's homepage at http://link.springer.com/
author2 chong-leong.gan@spansion.com
author_facet chong-leong.gan@spansion.com
Chong, Leong Gan
Uda
format Article
author Chong, Leong Gan
Uda
author_sort Chong, Leong Gan
title Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
title_short Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
title_full Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
title_fullStr Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
title_full_unstemmed Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package
title_sort reliability assessment and mechanical characterization of cu and au ball bonds in bga package
publisher Springer Science+Business Media New York
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/33099
_version_ 1643797067244503040
score 13.222552

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