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Reliability assessment and mechanical characterization of Cu and Au ball bonds in BGA package

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Bibliographic Details
Main Authors: Chong, Leong Gan, Uda
Other Authors: chong-leong.gan@spansion.com
Format: Article
Language:English
Published: Springer Science+Business Media New York 2014
Subjects:
Component reliability
Reliability assessments
Mechanical characterizations
High temperature storage lives
Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33099
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Summary:Link to publisher's homepage at http://link.springer.com/

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