صورة الغلاف

Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition

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محفوظ في:

التفاصيل البيبلوغرافية
المؤلف الرئيسي:	Norahmad Barzrul Basaruddin
مؤلفون آخرون:	Mohd Khairuddin Md Arshad (Advisor)
التنسيق:	Learning Object
اللغة:	English
منشور في:	Universiti Malaysia Perlis 2008
الموضوعات:	AlSi bond Aluminum bond pad activation Electroless plating Electroless nickel immersion gold Flip-chip (FC) Surface morphology Integrated circuits > Design and construction Integrated circuits > Materials
الوصول للمادة أونلاين:	http://dspace.unimap.edu.my/xmlui/handle/123456789/1351
الوسوم:	إضافة وسم لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!

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