Basaruddin, N. B., & (Advisor), M. K. M. A. (2008). Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition. Universiti Malaysia Perlis.
Chicago Style CitationBasaruddin, Norahmad Barzrul, and Mohd Khairuddin Md Arshad (Advisor). Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition. Universiti Malaysia Perlis, 2008.
MLA CitationBasaruddin, Norahmad Barzrul, and Mohd Khairuddin Md Arshad (Advisor). Characterization of Electroless Under Bump Metallurgy for Alsi Bond Pad Composition. Universiti Malaysia Perlis, 2008.
Warning: These citations may not always be 100% accurate.