The effect of different Sn-Ag-Cu (SAC) solder form on solder/Cu joint performance through microwave hybrid heating
Solder acts as a joining material in first level packaging such as controlled collapse chipconnection (C4). It helps to interconnect chip with substrate to provide electrical and mechanical continuity in electronic packaging. The quality of electronic packaging mostly relies on the solder joint that...
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| Format: | Thesis |
| Language: | English |
| Published: |
2023
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| Online Access: | http://umpir.ump.edu.my/id/eprint/39614/1/ir.The%20effect%20of%20different%20Sn-Ag-Cu%20%28SAC%29%20solder%20form%20on%20solder.pdf http://umpir.ump.edu.my/id/eprint/39614/ |
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