Effect of isothermal aging 2000 hours on intermetallics formed between ni-pd-au with sn-4ag-0.5cu solders
The present study investigated the effect of isothermal aging up to 2000 hours on the intermetallics formed between Sn-4Ag-0.5Cu lead free solder on electroless nickel electroless palladium immersion gold surface finish (Ni-Pd-Au). For all parameters, aging have an effect of changing the intermetall...
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| Main Authors: | , , , |
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| Format: | Conference or Workshop Item |
| Published: |
2013
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/51017/ http://dx.doi.org/10.4028/www.scientific.net/AMR.650.194 |
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