Cover Image

A review: effect of copper percentage solder alloy after laser soldering

Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interfacial reactions at the solder joint interface,...

Full description

Saved in:
Bibliographic Details
Main Authors: Asyraf, Abdullah, Siti Rabiatull Aisha, Idris
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2023
Subjects:
TS Manufactures
Online Access:http://umpir.ump.edu.my/id/eprint/37468/1/Effect%20Of%20Difference%20Copper%20Percentage%20In%20Solder%20Alloy1.pdf
http://umpir.ump.edu.my/id/eprint/37468/
https://doi.org/10.1108/SSMT-03-2022-0022
https://doi.org/10.1108/SSMT-03-2022-0022
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.ump.umpir.37468
record_format eprints
spelling my.ump.umpir.374682023-04-12T08:45:54Z http://umpir.ump.edu.my/id/eprint/37468/ A review: effect of copper percentage solder alloy after laser soldering Asyraf, Abdullah Siti Rabiatull Aisha, Idris TS Manufactures Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed. Emerald Group Publishing Limited 2023 Article PeerReviewed pdf en http://umpir.ump.edu.my/id/eprint/37468/1/Effect%20Of%20Difference%20Copper%20Percentage%20In%20Solder%20Alloy1.pdf Asyraf, Abdullah and Siti Rabiatull Aisha, Idris (2023) A review: effect of copper percentage solder alloy after laser soldering. Soldering & Surface Mount Technology, ahead-of-print (ahead-of-print). pp. 1-29. ISSN 0954-0911 https://doi.org/10.1108/SSMT-03-2022-0022 https://doi.org/10.1108/SSMT-03-2022-0022
institution Universiti Malaysia Pahang
building UMP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Pahang
content_source UMP Institutional Repository
url_provider http://umpir.ump.edu.my/
language English
topic TS Manufactures
spellingShingle TS Manufactures
Asyraf, Abdullah
Siti Rabiatull Aisha, Idris
A review: effect of copper percentage solder alloy after laser soldering
description Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed.
format Article
author Asyraf, Abdullah
Siti Rabiatull Aisha, Idris
author_facet Asyraf, Abdullah
Siti Rabiatull Aisha, Idris
author_sort Asyraf, Abdullah
title A review: effect of copper percentage solder alloy after laser soldering
title_short A review: effect of copper percentage solder alloy after laser soldering
title_full A review: effect of copper percentage solder alloy after laser soldering
title_fullStr A review: effect of copper percentage solder alloy after laser soldering
title_full_unstemmed A review: effect of copper percentage solder alloy after laser soldering
title_sort review: effect of copper percentage solder alloy after laser soldering
publisher Emerald Group Publishing Limited
publishDate 2023
url http://umpir.ump.edu.my/id/eprint/37468/1/Effect%20Of%20Difference%20Copper%20Percentage%20In%20Solder%20Alloy1.pdf
http://umpir.ump.edu.my/id/eprint/37468/
https://doi.org/10.1108/SSMT-03-2022-0022
https://doi.org/10.1108/SSMT-03-2022-0022
_version_ 1764222761805283328
score 13.211869

Similar Items