A review: effect of copper percentage solder alloy after laser soldering
Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interfacial reactions at the solder joint interface,...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Emerald Group Publishing Limited
2023
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/37468/1/Effect%20Of%20Difference%20Copper%20Percentage%20In%20Solder%20Alloy1.pdf http://umpir.ump.edu.my/id/eprint/37468/ https://doi.org/10.1108/SSMT-03-2022-0022 https://doi.org/10.1108/SSMT-03-2022-0022 |
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