A review: effect of copper percentage solder alloy after laser soldering
Purpose This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering. Design/methodology/approach This study reviews the interfacial reactions at the solder joint interface,...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Emerald Group Publishing Limited
2023
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| Subjects: | |
| Online Access: | http://umpir.ump.edu.my/id/eprint/37468/1/Effect%20Of%20Difference%20Copper%20Percentage%20In%20Solder%20Alloy1.pdf http://umpir.ump.edu.my/id/eprint/37468/ https://doi.org/10.1108/SSMT-03-2022-0022 https://doi.org/10.1108/SSMT-03-2022-0022 |
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| Summary: | Purpose
This study aims to review the effect of copper percentage in Sn-based solder alloys (Sn-xCu, x = 0–5 Wt.%) on intermetallic compound (IMC) formation and growth after laser soldering.
Design/methodology/approach
This study reviews the interfacial reactions at the solder joint interface, solder joint morphology and the theory on characterizing the formation and growth of IMCs. In addition, the effects of alloying and strengthening mechanism, including wettability, melting and mechanical properties are discussed. |
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