The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational Fluid Dynamic (CFD), FLUENT TM using epoxy moulding compound material (EMC)
The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel is carried out using a commercial CFD code, FLUENTTM by using Epoxy Moulding Co...
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| Main Authors: | , , , , , |
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| Format: | Non-Indexed Article |
| Published: |
Trans-Tech Publication
2013
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| Online Access: | http://discol.umk.edu.my/id/eprint/7868/ http://dx.doi.org/10.4028/www.scientific.net/AMR.795.174 |
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