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The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational Fluid Dynamic (CFD), FLUENT TM using epoxy moulding compound material (EMC)

The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel is carried out using a commercial CFD code, FLUENTTM by using Epoxy Moulding Co...

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Main Authors: Mazlan Mohamed, A.Rahim, Muhamad Iqbal Ahmad, Abdullah Mohd Mustafa Al Bakri, Razak Wahab, M.R Mohd Sukhairi
Format: Non-Indexed Article
Published: Trans-Tech Publication 2013
Online Access:http://discol.umk.edu.my/id/eprint/7868/
http://dx.doi.org/10.4028/www.scientific.net/AMR.795.174
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spelling my.umk.eprints.78682022-05-23T10:23:37Z http://discol.umk.edu.my/id/eprint/7868/ The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational Fluid Dynamic (CFD), FLUENT TM using epoxy moulding compound material (EMC) Mazlan Mohamed A.Rahim Muhamad Iqbal Ahmad Abdullah Mohd Mustafa Al Bakri Razak Wahab M.R Mohd Sukhairi The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel is carried out using a commercial CFD code, FLUENTTM by using Epoxy Moulding Compound (EMC) as a main material. The study was made for four and eight packages with different Reynolds Number and package chip powers. The results are presented in term of junction temperature for four and eight PLCC package under different conditions. It is observed the chip temperatures of eight PLCC packages have higher junction temperature compare to four PLCC packages due to effect of other PLCC because of space and gap between PLCC that have more number of PLCC is smaller. Hence it makes junction temperature of eight PLCC higher compare to four PLCC packages. Moreover, the junction temperature of the packages decreases with increase in Reynolds Number. Trans-Tech Publication 2013 Non-Indexed Article NonPeerReviewed Mazlan Mohamed and A.Rahim and Muhamad Iqbal Ahmad and Abdullah Mohd Mustafa Al Bakri and Razak Wahab and M.R Mohd Sukhairi (2013) The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational Fluid Dynamic (CFD), FLUENT TM using epoxy moulding compound material (EMC). Advanced Materials Research, 795. pp. 174-181. ISSN 1662-8985 http://dx.doi.org/10.4028/www.scientific.net/AMR.795.174 doi:10.4028/www.scientific.net/AMR.795.174 doi:10.4028/www.scientific.net/AMR.795.174
institution Universiti Malaysia Kelantan
building Perpustakaan Universiti Malaysia Kelantan
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Kelantan
content_source UMK Institutional Repository
url_provider http://umkeprints.umk.edu.my/
description The paper present the three dimensional numerical analysis of heat and fluid flow through Plastic Leaded Chip Carrier (PLCC) packages in inline orientation horizontally mounted on a printed circuit board in a wind tunnel is carried out using a commercial CFD code, FLUENTTM by using Epoxy Moulding Compound (EMC) as a main material. The study was made for four and eight packages with different Reynolds Number and package chip powers. The results are presented in term of junction temperature for four and eight PLCC package under different conditions. It is observed the chip temperatures of eight PLCC packages have higher junction temperature compare to four PLCC packages due to effect of other PLCC because of space and gap between PLCC that have more number of PLCC is smaller. Hence it makes junction temperature of eight PLCC higher compare to four PLCC packages. Moreover, the junction temperature of the packages decreases with increase in Reynolds Number.
format Non-Indexed Article
author Mazlan Mohamed
A.Rahim
Muhamad Iqbal Ahmad
Abdullah Mohd Mustafa Al Bakri
Razak Wahab
M.R Mohd Sukhairi
spellingShingle Mazlan Mohamed
A.Rahim
Muhamad Iqbal Ahmad
Abdullah Mohd Mustafa Al Bakri
Razak Wahab
M.R Mohd Sukhairi
The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational Fluid Dynamic (CFD), FLUENT TM using epoxy moulding compound material (EMC)
author_facet Mazlan Mohamed
A.Rahim
Muhamad Iqbal Ahmad
Abdullah Mohd Mustafa Al Bakri
Razak Wahab
M.R Mohd Sukhairi
author_sort Mazlan Mohamed
title The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational Fluid Dynamic (CFD), FLUENT TM using epoxy moulding compound material (EMC)
title_short The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational Fluid Dynamic (CFD), FLUENT TM using epoxy moulding compound material (EMC)
title_full The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational Fluid Dynamic (CFD), FLUENT TM using epoxy moulding compound material (EMC)
title_fullStr The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational Fluid Dynamic (CFD), FLUENT TM using epoxy moulding compound material (EMC)
title_full_unstemmed The comparison between four PLCC packages and eight PLCC packages in personal computer (PC) using computational Fluid Dynamic (CFD), FLUENT TM using epoxy moulding compound material (EMC)
title_sort comparison between four plcc packages and eight plcc packages in personal computer (pc) using computational fluid dynamic (cfd), fluent tm using epoxy moulding compound material (emc)
publisher Trans-Tech Publication
publishDate 2013
url http://discol.umk.edu.my/id/eprint/7868/
http://dx.doi.org/10.4028/www.scientific.net/AMR.795.174
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score 13.222552

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