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Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT

This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer using CFD Software. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four...

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Main Authors: Mazlan Mohamed, Muhamad Iqbal Ahmad, A.M. Mustafa Al Bakri, Huck-Soo Loo, M.S. Abdul Aziz, Abdullah. N.R
Format: Non-Indexed Article
Published: 2013
Online Access:http://discol.umk.edu.my/id/eprint/7859/
http://www.ajbasweb.com/ajbas/2013/Special,%20issue2%202013/220-229.pdf
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spelling my.umk.eprints.78592022-05-23T10:23:28Z http://discol.umk.edu.my/id/eprint/7859/ Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT Mazlan Mohamed Muhamad Iqbal Ahmad A.M. Mustafa Al Bakri Huck-Soo Loo M.S. Abdul Aziz Abdullah. N.R This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer using CFD Software. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four microprocessors arranged in line under different thickness of thermal pad, inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature of each package. It also found that the thickness of thermal pad, (chip) powers and inlet velocities are the most important elements to control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent. 2013-06-01 Non-Indexed Article NonPeerReviewed Mazlan Mohamed and Muhamad Iqbal Ahmad and A.M. Mustafa Al Bakri and Huck-Soo Loo and M.S. Abdul Aziz and Abdullah. N.R (2013) Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT. Australian Journal of Basic and Applied Sciences, 7 (5). pp. 220-229. ISSN 1991-8178 http://www.ajbasweb.com/ajbas/2013/Special,%20issue2%202013/220-229.pdf
institution Universiti Malaysia Kelantan
building Perpustakaan Universiti Malaysia Kelantan
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Kelantan
content_source UMK Institutional Repository
url_provider http://umkeprints.umk.edu.my/
description This paper presents the thermal management of electronic components, microprocessor by using three dimensional numerical analysis of heat and fluid flow in computer using CFD Software. 3D model of microprocessors is built using GAMBIT and simulated using FLUENT software. The study was made for four microprocessors arranged in line under different thickness of thermal pad, inlet velocities and package (chip) powers. The results are presented in terms of average junction temperature of each package. It also found that the thickness of thermal pad, (chip) powers and inlet velocities are the most important elements to control and manage the junction temperature. The strength of CFD software in handling heat transfer problems is proved to be excellent.
format Non-Indexed Article
author Mazlan Mohamed
Muhamad Iqbal Ahmad
A.M. Mustafa Al Bakri
Huck-Soo Loo
M.S. Abdul Aziz
Abdullah. N.R
spellingShingle Mazlan Mohamed
Muhamad Iqbal Ahmad
A.M. Mustafa Al Bakri
Huck-Soo Loo
M.S. Abdul Aziz
Abdullah. N.R
Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT
author_facet Mazlan Mohamed
Muhamad Iqbal Ahmad
A.M. Mustafa Al Bakri
Huck-Soo Loo
M.S. Abdul Aziz
Abdullah. N.R
author_sort Mazlan Mohamed
title Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT
title_short Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT
title_full Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT
title_fullStr Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT
title_full_unstemmed Three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using CFD software, FLUENT
title_sort three dimensional analysis of thermal pad made of nanomaterial, nano-silver with differences of thickness by using cfd software, fluent
publishDate 2013
url http://discol.umk.edu.my/id/eprint/7859/
http://www.ajbasweb.com/ajbas/2013/Special,%20issue2%202013/220-229.pdf
_version_ 1763303901082157056
score 13.222552

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