Three dimensional simulation of thermal pad using nanomaterial, nanosilver in semiconductor and electronic component application
Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70ºC will malfunction and damage due to the overheated. The design is used nano-silv...
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| Main Authors: | , , , , , |
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| Format: | Non-Indexed Article |
| Published: |
Trans-Tech Publication
2012
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| Online Access: | http://discol.umk.edu.my/id/eprint/7831/ http://dx.doi.org/10.4028/www.scientific.net/AMR.626.980 |
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| Summary: | Thermal pad is new technology in this world that been used in PLCC in order to reduce
junction temperature to the minimum level in electronic components. In electronic industry, the
electronic components that exceed 70ºC will malfunction and damage due to the overheated. The
design is used nano-silver as main material in thermo pad because it has high value of thermal
conductivity and enables to dissipate heat very efficiently. The simulation of thermal pad in
semiconductor is using FLUENTTM software. The results from simulation is been compared to the
results from experiment. The differences between those results are less than 10%. The advantages of
thermal pad are enables to reduce junction temperature of PLCC 20-30%. It also had constant
thickness in order to get constant and accurate results |
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