Staff View: Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe

Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe

Die attach material plays an important role in electronic packaging as it serves as an interconnection between SiC device and substrate, provides physical and mechanical support and serves as a heat dissipating path. An aluminum-copper (Al-Cu) nanopaste formulated by mixing Al and Cu nanoparticles w...

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Main Author:	Siah, Meng Zhe
Format:	Thesis
Published:	2019
Subjects:	TJ Mechanical engineering and machinery
Online Access:	http://studentsrepo.um.edu.my/11396/1/Siah_Meng_Zhe.jpg http://studentsrepo.um.edu.my/11396/8/meng_zhe.pdf http://studentsrepo.um.edu.my/11396/
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spelling	my.um.stud.113962020-07-13T23:58:19Z Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe Siah, Meng Zhe TJ Mechanical engineering and machinery Die attach material plays an important role in electronic packaging as it serves as an interconnection between SiC device and substrate, provides physical and mechanical support and serves as a heat dissipating path. An aluminum-copper (Al-Cu) nanopaste formulated by mixing Al and Cu nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol) which is meant for high-temperature die-attach applications has been developed. Various weight percent of V006A (4%,5%,6% and 7%) and the Al loading (10%, 20%, 30% and 40%) have been loaded into the Al-Cu nanopaste, followed by sintering in open air at temperature of 380°C for 30 min without the need of applied external pressure. The physical and electrical properties were investigated. X-ray diffraction results showed that Al2Cu and CuO phases were formed in sintered Al-Cu nanopaste. Overall, Al-Cu nanopaste with 5% V006A has exhibited the best electrical conductivity [21??.cm], lowest oxygen element [15.36%] and smallest crystallite size [8.15nm], which is suitable for high temperature electronic applications. Also, Al0.5-Cu4.5 demonstrated the lowest electrical resistivity at 21.70 ??.cm, which is acceptable for a high temperature die-attach material. 2019-08 Thesis NonPeerReviewed application/pdf http://studentsrepo.um.edu.my/11396/1/Siah_Meng_Zhe.jpg application/pdf http://studentsrepo.um.edu.my/11396/8/meng_zhe.pdf Siah, Meng Zhe (2019) Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe. Masters thesis, University Malaya. http://studentsrepo.um.edu.my/11396/
institution	Universiti Malaya
building	UM Library
collection	Institutional Repository
continent	Asia
country	Malaysia
content_provider	Universiti Malaya
content_source	UM Student Repository
url_provider	http://studentsrepo.um.edu.my/
topic	TJ Mechanical engineering and machinery
spellingShingle	TJ Mechanical engineering and machinery Siah, Meng Zhe Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
description	Die attach material plays an important role in electronic packaging as it serves as an interconnection between SiC device and substrate, provides physical and mechanical support and serves as a heat dissipating path. An aluminum-copper (Al-Cu) nanopaste formulated by mixing Al and Cu nanoparticles with organic additives (i.e., resin binder, terpineol and ethylene glycol) which is meant for high-temperature die-attach applications has been developed. Various weight percent of V006A (4%,5%,6% and 7%) and the Al loading (10%, 20%, 30% and 40%) have been loaded into the Al-Cu nanopaste, followed by sintering in open air at temperature of 380°C for 30 min without the need of applied external pressure. The physical and electrical properties were investigated. X-ray diffraction results showed that Al2Cu and CuO phases were formed in sintered Al-Cu nanopaste. Overall, Al-Cu nanopaste with 5% V006A has exhibited the best electrical conductivity [21??.cm], lowest oxygen element [15.36%] and smallest crystallite size [8.15nm], which is suitable for high temperature electronic applications. Also, Al0.5-Cu4.5 demonstrated the lowest electrical resistivity at 21.70 ??.cm, which is acceptable for a high temperature die-attach material.
format	Thesis
author	Siah, Meng Zhe
author_facet	Siah, Meng Zhe
author_sort	Siah, Meng Zhe
title	Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
title_short	Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
title_full	Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
title_fullStr	Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
title_full_unstemmed	Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
title_sort	development of aluminium-copper die-attach alloy for high operational temperature application / siah meng zhe
publishDate	2019
url	http://studentsrepo.um.edu.my/11396/1/Siah_Meng_Zhe.jpg http://studentsrepo.um.edu.my/11396/8/meng_zhe.pdf http://studentsrepo.um.edu.my/11396/
_version_	1738506478786969600
score	13.244745

Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe

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