Development of aluminium-copper die-attach alloy for high operational temperature application / Siah Meng Zhe
Die attach material plays an important role in electronic packaging as it serves as an interconnection between SiC device and substrate, provides physical and mechanical support and serves as a heat dissipating path. An aluminum-copper (Al-Cu) nanopaste formulated by mixing Al and Cu nanoparticles w...
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| Format: | Thesis |
| Published: |
2019
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| Online Access: | http://studentsrepo.um.edu.my/11396/1/Siah_Meng_Zhe.jpg http://studentsrepo.um.edu.my/11396/8/meng_zhe.pdf http://studentsrepo.um.edu.my/11396/ |
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