A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package
Due to the variation of temperature during service, the leads in quad flat packages (QFP) and plastic leaded chip carrier (PLCC) undergo high thermal stress, which can lead to large deformation and failure. Thus, the prediction of thermal stress and strain distributions is a prerequisite for reliabi...
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| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Institute of Electrical and Electronics Engineers
2021
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| Subjects: | |
| Online Access: | http://eprints.um.edu.my/25877/1/25877.pdf http://eprints.um.edu.my/25877/ https://doi.org/10.1109/TCPMT.2020.3046750 |
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