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A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package

Due to the variation of temperature during service, the leads in quad flat packages (QFP) and plastic leaded chip carrier (PLCC) undergo high thermal stress, which can lead to large deformation and failure. Thus, the prediction of thermal stress and strain distributions is a prerequisite for reliabi...

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Main Authors: Zhou, Ding, Haseeb, A.S. Md. Abdul, Andriyana, Andri, Wong, Yew Hoong, Sabri, Mohd Faizul Mohd, Low, B.Y., Pang, X.S., Eu, Poh Leng, Tan, L.C.
Format: Article
Language:English
Published: Institute of Electrical and Electronics Engineers 2021
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.um.edu.my/25877/1/25877.pdf
http://eprints.um.edu.my/25877/
https://doi.org/10.1109/TCPMT.2020.3046750
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spelling my.um.eprints.258772021-04-21T02:26:46Z http://eprints.um.edu.my/25877/ A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package Zhou, Ding Haseeb, A.S. Md. Abdul Andriyana, Andri Wong, Yew Hoong Sabri, Mohd Faizul Mohd Low, B.Y. Pang, X.S. Eu, Poh Leng Tan, L.C. TJ Mechanical engineering and machinery Due to the variation of temperature during service, the leads in quad flat packages (QFP) and plastic leaded chip carrier (PLCC) undergo high thermal stress, which can lead to large deformation and failure. Thus, the prediction of thermal stress and strain distributions is a prerequisite for reliability analysis of such components. Along this line, this work analyzed the performances for gull wing and J-lead with different geometries. The thermal stress and strain distributions of both leads were determined by using the finite-element method (FEM). For each type of the lead, a parametric study was conducted in order to evaluate the effect of lead geometry on stress and strain distributions. Based on the simulation results, an optimum lead design was suggested. In addition, simulation work of package under thermal cyclic loading has been done, accumulated creep strain was found in the critical location of solder in package, and lifetime was predicted. © 2011-2012 IEEE. Institute of Electrical and Electronics Engineers 2021 Article PeerReviewed text en http://eprints.um.edu.my/25877/1/25877.pdf Zhou, Ding and Haseeb, A.S. Md. Abdul and Andriyana, Andri and Wong, Yew Hoong and Sabri, Mohd Faizul Mohd and Low, B.Y. and Pang, X.S. and Eu, Poh Leng and Tan, L.C. (2021) A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (3). pp. 435-443. ISSN 2156-3950 https://doi.org/10.1109/TCPMT.2020.3046750 doi:10.1109/TCPMT.2020.3046750
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Zhou, Ding
Haseeb, A.S. Md. Abdul
Andriyana, Andri
Wong, Yew Hoong
Sabri, Mohd Faizul Mohd
Low, B.Y.
Pang, X.S.
Eu, Poh Leng
Tan, L.C.
A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package
description Due to the variation of temperature during service, the leads in quad flat packages (QFP) and plastic leaded chip carrier (PLCC) undergo high thermal stress, which can lead to large deformation and failure. Thus, the prediction of thermal stress and strain distributions is a prerequisite for reliability analysis of such components. Along this line, this work analyzed the performances for gull wing and J-lead with different geometries. The thermal stress and strain distributions of both leads were determined by using the finite-element method (FEM). For each type of the lead, a parametric study was conducted in order to evaluate the effect of lead geometry on stress and strain distributions. Based on the simulation results, an optimum lead design was suggested. In addition, simulation work of package under thermal cyclic loading has been done, accumulated creep strain was found in the critical location of solder in package, and lifetime was predicted. © 2011-2012 IEEE.
format Article
author Zhou, Ding
Haseeb, A.S. Md. Abdul
Andriyana, Andri
Wong, Yew Hoong
Sabri, Mohd Faizul Mohd
Low, B.Y.
Pang, X.S.
Eu, Poh Leng
Tan, L.C.
author_facet Zhou, Ding
Haseeb, A.S. Md. Abdul
Andriyana, Andri
Wong, Yew Hoong
Sabri, Mohd Faizul Mohd
Low, B.Y.
Pang, X.S.
Eu, Poh Leng
Tan, L.C.
author_sort Zhou, Ding
title A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package
title_short A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package
title_full A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package
title_fullStr A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package
title_full_unstemmed A parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package
title_sort parametric study of thermal stress and analysis of creep strain under thermal cyclic loading in a hybrid quad flat package
publisher Institute of Electrical and Electronics Engineers
publishDate 2021
url http://eprints.um.edu.my/25877/1/25877.pdf
http://eprints.um.edu.my/25877/
https://doi.org/10.1109/TCPMT.2020.3046750
_version_ 1698697312949239808
score 13.211869

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