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Influence of laser power on bonding strength for low purity copper wire bonding technology

The drive for improving copper wire bonding has been more rampant with continued rise in gold prices. The global increase in gold price directly resulted the semiconductor packaging industry to rapidly replace gold as a medium of interconnection to copper wire. This is a cost effective solution for...

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Main Authors: Singh, Gurbinder, Haseeb, A.S. Md. Abdul
Format: Article
Published: Elsevier 2019
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.um.edu.my/23422/
https://doi.org/10.1016/j.mee.2019.03.018
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spelling my.um.eprints.234222020-01-14T03:43:17Z http://eprints.um.edu.my/23422/ Influence of laser power on bonding strength for low purity copper wire bonding technology Singh, Gurbinder Haseeb, A.S. Md. Abdul TJ Mechanical engineering and machinery The drive for improving copper wire bonding has been more rampant with continued rise in gold prices. The global increase in gold price directly resulted the semiconductor packaging industry to rapidly replace gold as a medium of interconnection to copper wire. This is a cost effective solution for creating viable interconnections for integrated circuit packaging. However, through past research it is well known the hardness of copper wire is significantly higher compared to gold wire and the usage of copper poses various challenges in electronic packaging. These challenges, resulting from the usage of copper wire is primarily due to the high hardness of copper. Higher hardness of copper as compared to gold will require higher bonding force and ultrasonic energy to create bonding to the bond pads. The higher bonding force makes copper wire bonding unsuitable for fragile structures and possible damage to underlying circuitry. Past research has also exhibited the hardness of copper wire decreases as the purity levels increase, however the usage of higher purity copper wires in high volume manufacturing may significantly increase manufacturing cost. This research therefore investigates the application of laser assisted heating for enabling improved copper wire bonding strength and improved grain structures for low purity copper wires. Experimentations were conducted accordingly on three copper wire purity types, 99.9% purity (3 N), 99.99% purity (4 N) and 99.999% purity (5 N) copper wires, so as to evaluate the impact of laser assisted heating on various copper purity levels. The result of this study shows laser assisted heating is able to improve the bonding strength and improve the grain structure by means of reduced columnar grains for copper wires with lower purity levels. It is shown, higher as-bonded ball shear strengths with fewer columnar grains were observed when the highest laser heating intensity was applied. The results of this study can be helpful for integrated circuit packaging especially to enable interconnections using copper wire materials with lower purity levels, enabling a more cost effective manufacturing. © 2019 Elsevier B.V. Elsevier 2019 Article PeerReviewed Singh, Gurbinder and Haseeb, A.S. Md. Abdul (2019) Influence of laser power on bonding strength for low purity copper wire bonding technology. Microelectronic Engineering, 211. pp. 1-4. ISSN 0167-9317 https://doi.org/10.1016/j.mee.2019.03.018 doi:10.1016/j.mee.2019.03.018
institution Universiti Malaya
building UM Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaya
content_source UM Research Repository
url_provider http://eprints.um.edu.my/
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Singh, Gurbinder
Haseeb, A.S. Md. Abdul
Influence of laser power on bonding strength for low purity copper wire bonding technology
description The drive for improving copper wire bonding has been more rampant with continued rise in gold prices. The global increase in gold price directly resulted the semiconductor packaging industry to rapidly replace gold as a medium of interconnection to copper wire. This is a cost effective solution for creating viable interconnections for integrated circuit packaging. However, through past research it is well known the hardness of copper wire is significantly higher compared to gold wire and the usage of copper poses various challenges in electronic packaging. These challenges, resulting from the usage of copper wire is primarily due to the high hardness of copper. Higher hardness of copper as compared to gold will require higher bonding force and ultrasonic energy to create bonding to the bond pads. The higher bonding force makes copper wire bonding unsuitable for fragile structures and possible damage to underlying circuitry. Past research has also exhibited the hardness of copper wire decreases as the purity levels increase, however the usage of higher purity copper wires in high volume manufacturing may significantly increase manufacturing cost. This research therefore investigates the application of laser assisted heating for enabling improved copper wire bonding strength and improved grain structures for low purity copper wires. Experimentations were conducted accordingly on three copper wire purity types, 99.9% purity (3 N), 99.99% purity (4 N) and 99.999% purity (5 N) copper wires, so as to evaluate the impact of laser assisted heating on various copper purity levels. The result of this study shows laser assisted heating is able to improve the bonding strength and improve the grain structure by means of reduced columnar grains for copper wires with lower purity levels. It is shown, higher as-bonded ball shear strengths with fewer columnar grains were observed when the highest laser heating intensity was applied. The results of this study can be helpful for integrated circuit packaging especially to enable interconnections using copper wire materials with lower purity levels, enabling a more cost effective manufacturing. © 2019 Elsevier B.V.
format Article
author Singh, Gurbinder
Haseeb, A.S. Md. Abdul
author_facet Singh, Gurbinder
Haseeb, A.S. Md. Abdul
author_sort Singh, Gurbinder
title Influence of laser power on bonding strength for low purity copper wire bonding technology
title_short Influence of laser power on bonding strength for low purity copper wire bonding technology
title_full Influence of laser power on bonding strength for low purity copper wire bonding technology
title_fullStr Influence of laser power on bonding strength for low purity copper wire bonding technology
title_full_unstemmed Influence of laser power on bonding strength for low purity copper wire bonding technology
title_sort influence of laser power on bonding strength for low purity copper wire bonding technology
publisher Elsevier
publishDate 2019
url http://eprints.um.edu.my/23422/
https://doi.org/10.1016/j.mee.2019.03.018
_version_ 1657488207212707840
score 13.211869

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