Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition
Driven by the trends towards miniaturization in lead free electronic products, researchers are putting immense efforts to improve the properties and reliabilities of Sn based solders. Recently, much interest has been shown on low silver (Ag) content solder SAC105 (Sn-1.0Ag-0.5Cu) because of economic...
Saved in:
| Main Authors: | , |
|---|---|
| 格式: | Article |
| 語言: | English |
| 出版: |
MDPI
2016
|
| 主題: | |
| 在線閱讀: | http://eprints.um.edu.my/17440/1/HaseebASMA_%282016%29.pdf http://eprints.um.edu.my/17440/ http://dx.doi.org/10.3390/ma9070522 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|