Leong, Y. (2016). Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder with Minor Aluminum Addition. MDPI.
シカゴスタイル引用形Leong, Y.M. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder With Minor Aluminum Addition. MDPI, 2016.
MLA引用形式Leong, Y.M. Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder With Minor Aluminum Addition. MDPI, 2016.
警告: この引用は必ずしも正確ではありません.