Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
High performance and low temperature are important in designing a QFN package. This thesis discusses the design and analysis of a thermal effect based on the different epoxy thickness and material used. The different epoxy thickness combines the good features of the thermal resistance and rate of he...
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| フォーマット: | 学位論文 |
| 言語: | English |
| 出版事項: |
2012
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| オンライン･アクセス: | https://ir.uitm.edu.my/id/eprint/102998/1/102998.pdf https://ir.uitm.edu.my/id/eprint/102998/ |
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