Cover Image

Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie

High performance and low temperature are important in designing a QFN package. This thesis discusses the design and analysis of a thermal effect based on the different epoxy thickness and material used. The different epoxy thickness combines the good features of the thermal resistance and rate of he...

Full description

Saved in:
Bibliographic Details
Main Author: Mohd Safie, Mohd Syafiq
Format: Thesis
Language:English
Published: 2012
Online Access:https://ir.uitm.edu.my/id/eprint/102998/1/102998.pdf
https://ir.uitm.edu.my/id/eprint/102998/
Tags: Add Tag
No Tags, Be the first to tag this record!
id my.uitm.ir.102998
record_format eprints
spelling my.uitm.ir.1029982024-09-30T06:44:14Z https://ir.uitm.edu.my/id/eprint/102998/ Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie Mohd Safie, Mohd Syafiq High performance and low temperature are important in designing a QFN package. This thesis discusses the design and analysis of a thermal effect based on the different epoxy thickness and material used. The different epoxy thickness combines the good features of the thermal resistance and rate of heat flow in a QFN package. The QFN package design is focusing on the minimization of the package size and the temperature itself, which will improves the QFN package performance. This thesis will discuss how this project experimenting the thickness and material used to obtain the low temperature and high performance QFN package. The simulation results have been obtained using thermal flux, heat flow, and temperature are applied on the die, for load 50°C, 100°C and 125°C, considering steady-state analysis without vary with time. The simulation results are derived using ANSYS 13.0 software, which resulted nodal temperature, thermal gradient, and thermal flux. The results show that the lowest epoxy thickness and the material that have higher thermal conductivity give the lowest result of a thermal effect compared to the higher thickness and lowest thermal conductivity of a material. 2012 Thesis NonPeerReviewed text en https://ir.uitm.edu.my/id/eprint/102998/1/102998.pdf Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie. (2012) Degree thesis, thesis, Universiti Teknologi MARA. <http://terminalib.uitm.edu.my/102998.pdf>
institution Universiti Teknologi Mara
building Tun Abdul Razak Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Teknologi Mara
content_source UiTM Institutional Repository
url_provider http://ir.uitm.edu.my/
language English
description High performance and low temperature are important in designing a QFN package. This thesis discusses the design and analysis of a thermal effect based on the different epoxy thickness and material used. The different epoxy thickness combines the good features of the thermal resistance and rate of heat flow in a QFN package. The QFN package design is focusing on the minimization of the package size and the temperature itself, which will improves the QFN package performance. This thesis will discuss how this project experimenting the thickness and material used to obtain the low temperature and high performance QFN package. The simulation results have been obtained using thermal flux, heat flow, and temperature are applied on the die, for load 50°C, 100°C and 125°C, considering steady-state analysis without vary with time. The simulation results are derived using ANSYS 13.0 software, which resulted nodal temperature, thermal gradient, and thermal flux. The results show that the lowest epoxy thickness and the material that have higher thermal conductivity give the lowest result of a thermal effect compared to the higher thickness and lowest thermal conductivity of a material.
format Thesis
author Mohd Safie, Mohd Syafiq
spellingShingle Mohd Safie, Mohd Syafiq
Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
author_facet Mohd Safie, Mohd Syafiq
author_sort Mohd Safie, Mohd Syafiq
title Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
title_short Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
title_full Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
title_fullStr Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
title_full_unstemmed Thermal analysis of a QFN package with different epoxy thickness and material using ANSYS / Mohd Syafiq Mohd Safie
title_sort thermal analysis of a qfn package with different epoxy thickness and material using ansys / mohd syafiq mohd safie
publishDate 2012
url https://ir.uitm.edu.my/id/eprint/102998/1/102998.pdf
https://ir.uitm.edu.my/id/eprint/102998/
_version_ 1811690144304988160
score 13.211869

Similar Items