Beam parameters optimization of MEMS piezoresistive accelerometer by using response surface method
This article presents the optimization of a MEMS-based piezoresistive accelerometer sensor using design of experiment (DOE) approach. Two structures of accelerometers, which consist of a proof mass suspended by eight beams, have been investigated. Response surface method (RSM) was employed to op...
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主要な著者: | , , , |
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フォーマット: | Conference or Workshop Item |
言語: | English English English |
出版事項: |
2021
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主題: | |
オンライン・アクセス: | http://eprints.unisza.edu.my/4264/1/FH03-FRIT-21-55630.pdf http://eprints.unisza.edu.my/4264/2/FH03-FRIT-21-55631.pdf http://eprints.unisza.edu.my/4264/3/FH03-FRIT-21-56579.pdf http://eprints.unisza.edu.my/4264/ |
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要約: | This article presents the optimization of a MEMS-based piezoresistive accelerometer sensor using design of
experiment (DOE) approach. Two structures of
accelerometers, which consist of a proof mass suspended by
eight beams, have been investigated. Response surface method
(RSM) was employed to optimize the geometric beam
parameters (thickness, width and length) in order to obtain
high sensitivity with an appropriate resonant frequency that
satisfies the design requirements for airbag application. The
beam thickness, beam width, and beam length were optimized
to achieve 0-400Hz bandwidth with high sensitivity. By
implementing RSM, the best combination of the three
parameters for structure 1 was thickness, = 23 µm, width, =
210 µm, and length, = 800 µm. On the other hand, the best
combination of the three parameters for structure 2 was
thickness, = 20 µm, width, = 300 µm, and length, = 800 µm. As
a result, by using optimized beam parameters, the mechanical
sensitivity of the MEMS accelerometer sensor was increased by
almost 34.7% and 22.1% for structure 1 and structure 2,
respectively. The optimization results showed that the
predicted beam parameters of MEMS accelerometer managed
to achieve the target specifications for airbag application.
Hence, the approach can be successfully applied in improving
performance of MEMS-based devices. |
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