Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer
This paper is aimed at studying the thermal distribution and its associated effects on a thermal heat sink of a mobile computer (laptop). Possible thermal effects are investigated using Finite-Element Method with the help of a FEM software (Ansys Workbench 14). Physical changes of the structure s...
保存先:
主要な著者: | Xavier, A., Lim, C. S. |
---|---|
フォーマット: | 論文 |
言語: | English |
出版事項: |
IOP Publishing
2015
|
主題: | |
オンライン・アクセス: | http://eprints.intimal.edu.my/234/1/Simulation%20and%20Analysis%20of%20Temperature%20Distribution%20and.pdf http://eprints.intimal.edu.my/234/ http://dx.doi.org/10.1088/1757-899X/88/1/012043 |
タグ: |
タグ追加
タグなし, このレコードへの初めてのタグを付けませんか!
|
類似資料
-
Thermal analysis of microchannel heat sink
著者:: Mohd Sa'at, Fatimah Al-Zahrah
出版事項: (2006) -
Phase change material/heat pipe and Copper foam-based heat sinks for thermal management of electronic systems
著者:: Hayat, M.A., 等
出版事項: (2020) -
Finite element analysis of heat sink in term of thermal and temperature distribution with different chip power input
著者:: Mohamed, Mazlan, 等
出版事項: (2018) -
Development of a microchannel heat sink for thermal management
著者:: Yeo, Wei Long
出版事項: (2019) -
Efficient thermal energy management of hollow pin fin heat sinks with and without phase change material
著者:: Ong, K.S., 等
出版事項: (2021)