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Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer

This paper is aimed at studying the thermal distribution and its associated effects on a thermal heat sink of a mobile computer (laptop). Possible thermal effects are investigated using Finite-Element Method with the help of a FEM software (Ansys Workbench 14). Physical changes of the structure s...

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Main Authors: Xavier, A., Lim, C. S.
Format: Article
Language:English
Published: IOP Publishing 2015
Subjects:
TJ Mechanical engineering and machinery
Online Access:http://eprints.intimal.edu.my/234/1/Simulation%20and%20Analysis%20of%20Temperature%20Distribution%20and.pdf
http://eprints.intimal.edu.my/234/
http://dx.doi.org/10.1088/1757-899X/88/1/012043
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spelling my-inti-eprints.2342016-09-15T07:40:59Z http://eprints.intimal.edu.my/234/ Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer Xavier, A. Lim, C. S. TJ Mechanical engineering and machinery This paper is aimed at studying the thermal distribution and its associated effects on a thermal heat sink of a mobile computer (laptop). Possible thermal effects are investigated using Finite-Element Method with the help of a FEM software (Ansys Workbench 14). Physical changes of the structure such as temperature change and deformation are measured and are used as the basis for comparison between models of heat sinks. This paper also attempts to study the effect of thermal loading on the materials found in a heat sink hardware in terms of stresses that may arise due to physical restraints in the hardware as well as provide an optimized solution to reduce its form factor in order to be comparable to an Ultrabook class heat-sink. An optimized solution is made based on a cylindrical fin concept. IOP Publishing 2015 Article PeerReviewed text en http://eprints.intimal.edu.my/234/1/Simulation%20and%20Analysis%20of%20Temperature%20Distribution%20and.pdf Xavier, A. and Lim, C. S. (2015) Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer. IOP Conference Series: Materials Science and Engineering, 88 (1). ISSN 1757-899X http://dx.doi.org/10.1088/1757-899X/88/1/012043 10.1088/1757-899X/88/1/012043
institution INTI International University
building INTI Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider INTI International University
content_source INTI Institutional Repository
url_provider http://eprints.intimal.edu.my
language English
topic TJ Mechanical engineering and machinery
spellingShingle TJ Mechanical engineering and machinery
Xavier, A.
Lim, C. S.
Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer
description This paper is aimed at studying the thermal distribution and its associated effects on a thermal heat sink of a mobile computer (laptop). Possible thermal effects are investigated using Finite-Element Method with the help of a FEM software (Ansys Workbench 14). Physical changes of the structure such as temperature change and deformation are measured and are used as the basis for comparison between models of heat sinks. This paper also attempts to study the effect of thermal loading on the materials found in a heat sink hardware in terms of stresses that may arise due to physical restraints in the hardware as well as provide an optimized solution to reduce its form factor in order to be comparable to an Ultrabook class heat-sink. An optimized solution is made based on a cylindrical fin concept.
format Article
author Xavier, A.
Lim, C. S.
author_facet Xavier, A.
Lim, C. S.
author_sort Xavier, A.
title Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer
title_short Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer
title_full Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer
title_fullStr Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer
title_full_unstemmed Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer
title_sort simulation and analysis of temperature distribution and material properties change of a thermal heat sink undergoing thermal loading in a mobile computer
publisher IOP Publishing
publishDate 2015
url http://eprints.intimal.edu.my/234/1/Simulation%20and%20Analysis%20of%20Temperature%20Distribution%20and.pdf
http://eprints.intimal.edu.my/234/
http://dx.doi.org/10.1088/1757-899X/88/1/012043
_version_ 1644541155903275008
score 13.211869

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